wince bsp克隆 故障

按步骤一步步都没动克隆的BSP 结果出现错误

the selected cec file references a child component '{A0889642-D2D0-4757-8BFC-80583244E9FA}'that was not found in the catalog or in the cec file.

    component type #2,implementation #1.

 这个错误是在添加克隆的bsp的cec文件时出现。

用记事本打开新的CEC文件找到A0889642-D2D0-4757-8BFC-80583244E9FA 删除这行即可

ComponentType
(
 Name ( "BSPs" )
 GUID ( {3CABD6DA-B577-4A87-9490-9432E80DC2F1} )
 Description ( "Board Support Packages" )
 MaxResolvedImpsAllowed( 999 )
 Implementations
 (
  Implementation
  (
   Name ( "JLHW MD1000: ARMV4I" )
   GUID ( {2608A598-DD54-4F6F-9377-BBFCCB50467F} )
   Description ( "A BSP for the Samsung SMDK2440A Development Platform. JLHW" )
   BSPPlatformDir ( "md1000" )
   Version ( "5.0.0.0" )
   Locale ( 0409 )
   Vendor ( "JLHW" )
   Date ( "2004-4-15" )
   Children ( "{9A0957DA-F9E2-4AFB-9A52-59619EC1D994}" )
   Children ( "{A0889642-D2D0-4757-8BFC-80583244E9FA}" )
   SizeIsCPUDependent( 1 )
   CPUSizeMultiplier( 1.0 )
   BuildMethods
   (
    BuildMethod
    (
     GUID ( {587FF950-C512-4D19-A6E8-7A3107BBD5F4} )
     Step ( BSP )
     CPU ( "ARMV4I" )
    )
    BuildMethod
    (
     GUID ( {B02D3F25-2ECB-48D6-91D6-CD8EEBB76865} )
     Step ( BSP )
     CPU ( "ARMV4I" )
    )
   )
  )
 )
)